Advanced Technologies
Advanced component technologies
High Density Interconnect (HDI)
Flexible Circuits
High Speed / SI
Power Integrity Analysis
Creepage & Clearance
EMC
3D Component Heights
Wire Bonding
PCI, PCIe, PCI104, DDR(X)
Blind, buried, internal, laser vias
Flex, flexi-rigid, Multilayer HDI
Impedance control, Phase Tolerancing, Propagation Delay (including Relative)
Appraisal of power planes together with good layout techniques to ensure optimum power stability & delivery
Ensuring designs conform with IPC-2221 & UL60950-1 safety standard when required.
Using sound design principles to optimise the design for EMC
Height information added to aid complex mechanical challenges
Below are some examples of technology we regularly implement in our customer’s PCB layouts.
Bus Interface Systems and Networking,
PCI_Express, PCI, AGP1x, AGP2x, AGP4x, AGP8x, SCSI, SATA, USB, 1394, ISA, VME, IDE, XAUI, Gigabit Ethernet, Fibre Channel, 0Gb/E, LDVS
Memory Interfaces
SDRAM, DDR(X), CompactFLASH
RF/Microwave Design
GSM, GPS, Zigbee, Bluetooth, WiMax, GPRS, UMTS, Edge and LTE
