Capabilities

Advanced Technologies

Advanced component technologies

High Density Interconnect (HDI)

Flexible Circuits

High Speed / SI

Power Integrity Analysis

Creepage & Clearance

EMC

3D Component Heights

Wire Bonding

PCI, PCIe, PCI104, DDR(X)

Blind, buried, internal, laser vias

Flex, flexi-rigid, Multilayer HDI

Impedance control, Phase Tolerancing, Propagation Delay (including Relative)

Appraisal of power planes together with good layout techniques to ensure optimum power stability & delivery

Ensuring designs conform with IPC-2221 & UL60950-1 safety standard when required.

Using sound design principles to optimise the design for EMC

Height information added to aid complex mechanical challenges

Below are some examples of technology we regularly implement in our customer’s PCB layouts.

Bus Interface Systems and Networking,
PCI_Express, PCI, AGP1x, AGP2x, AGP4x, AGP8x, SCSI, SATA, USB, 1394, ISA, VME, IDE, XAUI, Gigabit Ethernet, Fibre Channel, 0Gb/E, LDVS

Memory Interfaces
SDRAM, DDR(X), CompactFLASH

RF/Microwave Design
GSM, GPS, Zigbee, Bluetooth, WiMax, GPRS, UMTS, Edge and LTE