Increasingly PCB designs are becoming more complicated:
Complex IC’s with increasingly higher input/output count.
Smaller BGAs on a finer pitch – (uBGA) 0.3mm
Ever increasing edge rates, have all necessitated the introduction or new interconnecting technologies to successfully complete complex designs.
With these developing technologies and higher density layouts, the use of finer track lines and smaller interconnect via holes have become inevitable. Introducing the need of microvia technology to solve fine pitched components.
Utilising laser, internal, buried and blind vias gives you more layout options including separation of RF and digital circuits placed on either side of the PCB using the correct build.
With increasing applications requiring impedance control for high frequency tracking to preserve data integrity and signal quality whilst preventing signal degradation. It is extremely important to get this right, impedance is always controlled by it’s inductive and capacitive reactance, resistance and conductance. All of which are controlled by the PCB layer stack.
DL Designs always agrees the PCB layer stack with the chosen PCB manufacturer on complex layouts prior to commencement, to safeguard the impedance requirements. Thus ensuring manufacturing ability without incurring unnecessary build costs.
Via in pad, usually (but not always) a microvia in a component pad which is either copper or resin filled before planed flat and plated to give a smooth flat pad.
Drilling the unused portion of a via or TH pad) barrel in order to remove the stub.